About TylSemi, Inc.
The Opportunity
The AI infrastructure market is exploding. Every hyperscaler, every cloud provider, every AI company is building custom silicon. But they all face the same problem: how do you connect hundreds of chips, deliver clean power at scale, and move terabits of data without melting the package?
That's what we solve. TylSemi builds the chiplet infrastructure IP — the IO, power delivery, and interconnect building blocks — that makes AI/HPC systems actually work at scale.
This isn't a nice-to-have. It's the critical path.
Why Now
The Market Window
The semiconductor industry is going through its biggest architectural shift in 40 years:
Moore's Law is dead. 2nm and beyond delivers marginal performance gains. The future is chiplets, not monolithic dies.
Custom silicon is now mainstream. Google, Microsoft, Amazon, Meta, OpenAI — they're all designing their own ASICs. The $50B custom silicon market is growing 30% annually.
IO and power are the bottleneck. Solve hard problems and provide something which is a category in itself.
Translation: We're entering the market at exactly the moment when every major AI/HPC player needs what we're building, and their alternatives are disappearing.
Culture & Team: How We Work
No Politics, No Bureaucracy
There are no layers, no approval chains, no corporate theater.
If you have an idea, we test it. If it works, we ship it.
No endless meetings, no PowerPoint presentations to convince middle management.
Remote-Friendly, Global Team
US team: Bay Area preferred, but we hire the best people regardless of location
India team: Building a world-class design center in Bangalore
Move Fast, Ship Real Products
We're not a research project. We have paying customers, committed capital, and aggressive timelines.
This is a company, not a lifestyle business. We're building to win.
What We Value
Ownership mindset. You're not here to execute someone else's roadmap. You're here to define it.
Bias for action. We move fast. Analysis paralysis doesn't fly here.
Deep technical expertise. This is hard engineering. We need people who've shipped real silicon and debugged real hardware.
Low ego, high standards. We don't care about titles or politics. We care about results.
The Ask
If you're reading this, you're probably comfortable. You have a good job at a stable company with all the benefits.
We're asking you to walk away from that and bet on us.
Here's why you should:
The market is real. AI infrastructure spending is $200B+ annually and growing 40% YoY. Every hyperscaler needs what we're building.
The team has done this before. We've built and exited semiconductor companies at scale. This isn't our first rodeo.
The traction is de-risked. We have LOIs, strategic investors, and a clear path to revenue.
The work is consequential. You're not optimizing someone's ad click-through rate. You're building the silicon infrastructure that powers AI.
This is the bet. Join us and build something that matters.
Or stay comfortable. No judgment.
But if you're the kind of person who wants to take the shot, we'd love to talk.
READY TO JOIN?
Role Overview
As an Analog Design Engineer at Tylsemi, you will design and deliver high-performance analog and mixed-signal circuits that enable robust, manufacturable silicon. This role spans a wide experience range (5–30 years) and is ideal for engineers who combine strong fundamentals with practical execution—translating system requirements into silicon-ready designs, validating performance across corners, and partnering closely with layout, verification, test, and product teams to drive first-time-right outcomes.
WhatYou’llDo
Own end-to-end analog block development: requirements definition, architecture, transistor-level design, simulation, and signoff
Design andoptimizeanalog/mixed-signal circuits such as amplifiers, references, biasing, regulators (LDO/DC-DC support), comparators, oscillators/clocking, data converters (as applicable), and sensor/AFE front ends
Drive performance across PVT corners, mismatch/Monte Carlo, aging/reliability considerations, and realistic loading/interaction with surrounding blocks
Partner with layout to guidefloorplanning, matching/guarding strategies, parasitic-aware design, and post-layout closure (PEX)
Develop and maintain testbenches, modeling collateral, and documentation to enable efficient verification and integration
Support silicon bring-up and debug: correlate lab data to simulations, root-cause issues, and implement design fixes or ECOs
Collaborate cross-functionally with digital, firmware, DFT, validation, and product engineering to ensure system-level success
Contribute to designmethodologyimprovements: reusable circuits, checklists, signoff flows, and best practices that scale across programs WhatWe’reLooking For
5+ years of experience in analog or mixed-signal IC design (scope and ownership aligned to experience level)
Strong fundamentals in analog circuit design, device physics, noise, stability/compensation, and feedback systems
Proficiencywith industry-standard EDA tools and simulation flows (e.g.,Spectre/HSPICE, ADE, waveform/debug tooling)
Experience closing designs through post-layoutparasiticsand across process/voltage/temperature corners
Ability to translate ambiguous system needs into clear block requirements and executable design plans
Strong debugging skills and comfort working with lab/validation teams to correlate silicon to simulation
Clear communication and high ownership in cross-site, cross-functional environments Nice to Have
Experience with high-speed or precision analog (low-noise, low-offset, high-linearity) depending on product needs
Background in power management (LDOs, bandgaps, references, protection, start-up, transient response)
ADC/DAC, Power related analog experience
Familiarity with reliability/ESD considerations and design-for-manufacturability practices
Experience supporting production ramp: yield learning, characterization, and test correlation Success in This Role Looks Like
Analog blocks meet spec with margin across PVT, mismatch, and post-layout effects
Design reviews are crisp: requirements, tradeoffs, and risks are clearly articulated and managed
Siliconbring-up converges quickly through strong correlation, structured debug, and decisive fixes
Cross-functional partners (layout, verification, test, validation) can execute efficiently with clear interfaces and documentation
Reusable design collateral and improvedmethodologyreduce cycle time and increase first-pass success
TylSemi builds chiplet infrastructure IP — specifically IO, power delivery, and interconnect building blocks — that enable AI and HPC systems to operate at scale. The company addresses a critical bottleneck in the semiconductor industry's shift from monolithic dies to chiplets, providing solutions that major hyperscalers and custom silicon designers need as alternatives disappear. TylSemi serves the rapidly growing custom silicon market, which is expanding at 30% annually and is valued at $50B+. The company has paying customers, committed capital, and is positioned to capitalize on the industry's biggest architectural shift in 40 years.
