At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.
Job Overview
TE Connectivity plc (NYSE: TEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enables the distribution of power, signal, and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology, and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn, Facebook, WeChat and Instagram.
BU / FUNCTION DESCRIPTION
Key markets of Digital Data Networks are Artificial Intelligence (AI), Cloud, Enterprise/Telecommunications, Tier 3/Business Retail Equipment (BRE), and Internet of Things (IoT). In these markets, we are driving growth and innovation with an industry-leading product portfolio and global manufacturing capabilities. TE /448GB/shas specialized in socket products since 1970 and has developed a large size socket (>10K pin count), small pitch socket (<0.4mm pitch) for high-speed applications (224/448Gbps)
ROLE OBJECTIVE
As Principal R&D Product Development Engineer of the DDN socket team, you will focus on creating relationships with customer innovators and influencers, defining and driving technical activities, coordinating and facilitating technical engineering-related communications for internal/external customers, creating the product standard for a key technology, and contributing to the technical roadmap of the socket products.
Job Requirements
Develop innovative design concepts and conduct feasibility studies to assess technical and commercial viability.
Collaborate with global Product Design Engineering (PDE) teams to accurately convert VOC and PRD into detailed design inputs for precise socket development.
Create simplified 3D models and perform signal integrity (SI) simulations using advanced tools such as Ansys HFSS to validate electrical signal performance.
Build and test prototype samples, execute design validation plans, and complete product qualification to finalize specifications.
Lead end-to-end product development of high-speed, fine-pitch, large-size sockets—from market definition, concept creation to design, review, and production release.
Foster strong alignment between business and customer engineering teams to deepen market understanding and drive customer-centric innovation.
Responsible for mentoring and training engineering teams in advanced mechanical design principles and signal integrity simulation methodologies, including hands-on guidance in using industry-standard tools such as Creo and Ansys HFSS, to ensure design robustness, performance optimization, and alignment with high-speed interconnect requirements.
Collaborate closely with customers and internal stakeholders (Sales, System Architects, FAEs, and PMs) to capture clear Voice of Customer (VOC) and translate it into conceptual designs and preliminary product specifications.
Engage in early-stage pathfinding with customers to co-develop cutting-edge interconnect solutions that meet future technological needs.
Prepare and present engineering evaluations and proposals to customers, aligning solutions with application requirements and performance targets
Provide technical support to manufacturing and quality teams to ensure efficient ramp-up, process optimization, and safe product launches.
Support cross-functional teams—including customers, Sales, PMs, and manufacturing sites—through DFMEA, testing, troubleshooting, and engineering analysis.
What your background should look like
Bachelor’s degree in Mechanical or Mechatronics Engineering; Master’s degree preferred.
Minimum of 5 years of work experience in mechanical design for high-speed interconnect products, with high-speed signal integrity knowledge preferred.
Direct customer design and support experience, including the ability to work with Field Application Engineers to troubleshoot customer problems and improve existing designs.
Design experience with high-speed servers, switches, and memory is a plus.
Understanding semiconductor IC packaging and fundamental test/burn-in methodology.
Expert-level knowledge of interconnect design or experience with high-speed connectors with PCIE Gen 6/7 compliance.
High level of competency in mechanical design tools such as Creo/SolidWorks.
Good level of competency in signal integrity analysis tools (Ansys HFSS, Keysight ADS).
Strong analytical capabilities to interpret simulation and lab data, identify issues, and provide solutions.
Six Sigma methodologies or other strong data analytics background is a plus.
Excellent verbal and written communication skills.
Ability to work in a global environment, fluent in English (verbal/written), and able to collaborate across geographies.
Highly motivated, quick learner, and able to work independently.
Competencies
SET : Strategy, Execution, Talent (for managers)
