Description:
The NXP Chief Technology Office (CTO) manages innovation within NXP providing the tools, knowledge, and processes for the businesses to create great new products for our customers. Within CTO, the Chip-Package Interaction (CPI) team ensures waferfab technologies meet the NXP CPI requirements in assembly, test, and over product life.
Key responsibilities of the job holder include the following:
- CPI lead in development, transfers, and changes of waferfab technologies
- To drive, and be part of, cross-functional and international teams supporting technology qualification and production across various silicon and packaging technologies
- Interact closely with waferfab process, packaging, quality, test, and product development teams to deliver best-in-class integral CPI solutions
Requirements:
- M.S. or Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, or Physics
- Proven experience with wafer-fab processes, semiconductor-packaging technologies and, preferably, CPI
- Team player with the ability to develop strong and effective working relationships across the company and with our suppliers
- Good communication skills, able to influence others with clear information to timely deliver on commitments
- Skill and affinity in data analysis
Taiwan
